Taking and placing device for gallium arsenide wafer
The utility model discloses a picking and placing device for gallium arsenide wafers, which relates to the technical field of gallium arsenide wafer processing and comprises a supporting plate, a polishing mechanism is arranged at the top of the supporting plate, transmission mechanisms are symmetri...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The utility model discloses a picking and placing device for gallium arsenide wafers, which relates to the technical field of gallium arsenide wafer processing and comprises a supporting plate, a polishing mechanism is arranged at the top of the supporting plate, transmission mechanisms are symmetrically arranged on two sides of the supporting plate, and a supporting frame is arranged outside the transmission mechanisms. A taking and placing assembly is arranged on the side, close to the supporting plate, of the supporting frame, an auxiliary assembly is arranged at one end of the taking and placing assembly, the taking and placing assembly comprises a circular supporting plate, a rotating seat is arranged at the top of the circular supporting plate, a hydraulic cylinder and a supporting transverse plate are arranged at the top end of the rotating seat, and a connecting pipe is arranged at the top of the supporting transverse plate. According to the utility model, the pick-and-place of the wafer is realized t |
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