Packaging heat dissipation structure

The utility model provides a packaging heat radiation structure, relates to the chip packaging technology field, the packaging heat radiation structure comprises a substrate, a structure chip and a heat radiation cover, the structure chip is arranged on the substrate, the heat radiation cover is pasted on one side surface of the structure chip far away from the substrate, an air flow channel is formed in the heat radiation cover, and the air flow channel is communicated with the structure chip. An airflow hole is further formed in the surface of the side, away from the structural chip, of the heat dissipation cover and communicates with the airflow channel. During actual use, heat generated by the structural chip can be transmitted through the heat dissipation cover, the heat dissipation effect of the heat dissipation cover can be improved through the airflow channels and the airflow holes, high-temperature melting of the heat dissipation cover during reflow soldering can be prevented, and the situation that