Multi-layer high-density PCB welding device
The utility model relates to the technical field of PCB processing, and discloses a multi-layer high-density PCB welding device which comprises a base, a movable groove is formed in the middle of the upper end face of the base, a two-way threaded rod is rotationally connected between the inner walls...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The utility model relates to the technical field of PCB processing, and discloses a multi-layer high-density PCB welding device which comprises a base, a movable groove is formed in the middle of the upper end face of the base, a two-way threaded rod is rotationally connected between the inner walls of the two sides of the movable groove, and the outer walls of the two ends of the two-way threaded rod are both sleeved with adjusting sliding seats in a threaded mode. Clamping rods are fixedly connected to the upper end faces of the two adjusting sliding seats, rotating rods are rotationally connected to the upper portions of the opposite sides of the two clamping rods, and clamping frames are fixedly connected to the other ends of the two rotating rods. According to the utility model, through the arrangement of the adjustable clamping and overturning structure, the purpose of better adjustment and use can be achieved according to the length requirement of the PCB and the welding requirement, so that better con |
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