Electronic device

The utility model provides electronic equipment. The electronic equipment comprises a mainboard and a processor arranged on the mainboard, the heat dissipation layer is stacked on the mainboard and is close to the processor; the middle frame is arranged in the electronic equipment and is used for supporting the mainboard and the processor; a groove is formed in the supporting face, supporting the main board, of the middle frame. And first heat-conducting glue is arranged in the groove and between the middle frame at the groove and the main board. According to the electronic equipment, the heat dissipation effect on the processor is good. 本公开提供一种电子设备，该电子设备包括主板，及设置于所述主板上的处理器；散热层，层叠设置于所述主板，且靠近所述处理器处；中框，设于所述电子设备内部，用于支撑所述主板及所述处理器；在所述中框支撑所述主板的支撑面上，开设有凹槽；所述凹槽，及在所述凹槽处的所述中框与所述主板之间，设置有第一导热胶。该电子设备中对处理器的散热效果较好。