High-power multichannel modulation light emitting module structure

The utility model discloses a high-power multichannel modulation light emission module structure, which relates to the technical field of light emission and comprises an emission assembly carrier PCB (printed circuit board), and a light emission assembly, a light splitting assembly, a light modulation assembly and a light conduction assembly are sequentially arranged at the top of the emission assembly carrier PCB. The light emitting assembly comprises a first metal conducting layer arranged on one side of the top of an emitting assembly carrier PCB, a DFB chip heat sink is arranged on the top of the first metal conducting layer, and a DFB laser chip is arranged on the top of the DFB chip heat sink. According to the utility model, the components are assembled on the transmitting component carrier PCB in an integrated packaging manner, the integration level of the product is greatly improved, and the laser emitted by the high-power DFB laser chip is divided into four independent light paths through the light s