Light-weight high-heat-dissipation APU host structure
The utility model discloses a light-weight high-heat-dissipation APU host structure. The APU host structure comprises an upper cover, a circuit board and a lower cover which are sequentially arranged from top to bottom, the upper cover comprises a front blocking piece, a heat dissipation piece and a...
Gespeichert in:
| Hauptverfasser: | , |
|---|---|
| Format: | Patent |
| Sprache: | chi ; eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | SUN GUODONG YE SHENGLONG |
| description | The utility model discloses a light-weight high-heat-dissipation APU host structure. The APU host structure comprises an upper cover, a circuit board and a lower cover which are sequentially arranged from top to bottom, the upper cover comprises a front blocking piece, a heat dissipation piece and a rear blocking piece which are sequentially welded from front to back. A plurality of radiating fins are formed on the upper surface of the radiating piece by adopting an aluminum extrusion process; raised grains are formed on the surface, used for heat dissipation, of the heat dissipation piece; the circuit board is attached to the lower surface of the heat dissipation piece, and the front end and the rear end of the circuit board are limited by a front blocking piece and a rear blocking piece respectively. The front blocking piece is provided with a receding groove matched with an interface terminal of the circuit board. The lower cover is attached to the lower surface of the circuit board and is locked on the he |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN221202960UU</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN221202960UU</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN221202960UU3</originalsourceid><addsrcrecordid>eNrjZDD1yUzPKNEtTwVRChlAUjcjNbFENyWzuDizILEkMz9PwTEgVCEjv7hEobikqDS5pLQolYeBNS0xpziVF0pzMyi5uYY4e-imFuTHpxYXJCan5qWWxDv7GRkZGhkYWZoZhIYaE6UIAL1dLeU</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Light-weight high-heat-dissipation APU host structure</title><source>esp@cenet</source><creator>SUN GUODONG ; YE SHENGLONG</creator><creatorcontrib>SUN GUODONG ; YE SHENGLONG</creatorcontrib><description>The utility model discloses a light-weight high-heat-dissipation APU host structure. The APU host structure comprises an upper cover, a circuit board and a lower cover which are sequentially arranged from top to bottom, the upper cover comprises a front blocking piece, a heat dissipation piece and a rear blocking piece which are sequentially welded from front to back. A plurality of radiating fins are formed on the upper surface of the radiating piece by adopting an aluminum extrusion process; raised grains are formed on the surface, used for heat dissipation, of the heat dissipation piece; the circuit board is attached to the lower surface of the heat dissipation piece, and the front end and the rear end of the circuit board are limited by a front blocking piece and a rear blocking piece respectively. The front blocking piece is provided with a receding groove matched with an interface terminal of the circuit board. The lower cover is attached to the lower surface of the circuit board and is locked on the he</description><language>chi ; eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240621&DB=EPODOC&CC=CN&NR=221202960U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25562,76317</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240621&DB=EPODOC&CC=CN&NR=221202960U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SUN GUODONG</creatorcontrib><creatorcontrib>YE SHENGLONG</creatorcontrib><title>Light-weight high-heat-dissipation APU host structure</title><description>The utility model discloses a light-weight high-heat-dissipation APU host structure. The APU host structure comprises an upper cover, a circuit board and a lower cover which are sequentially arranged from top to bottom, the upper cover comprises a front blocking piece, a heat dissipation piece and a rear blocking piece which are sequentially welded from front to back. A plurality of radiating fins are formed on the upper surface of the radiating piece by adopting an aluminum extrusion process; raised grains are formed on the surface, used for heat dissipation, of the heat dissipation piece; the circuit board is attached to the lower surface of the heat dissipation piece, and the front end and the rear end of the circuit board are limited by a front blocking piece and a rear blocking piece respectively. The front blocking piece is provided with a receding groove matched with an interface terminal of the circuit board. The lower cover is attached to the lower surface of the circuit board and is locked on the he</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDD1yUzPKNEtTwVRChlAUjcjNbFENyWzuDizILEkMz9PwTEgVCEjv7hEobikqDS5pLQolYeBNS0xpziVF0pzMyi5uYY4e-imFuTHpxYXJCan5qWWxDv7GRkZGhkYWZoZhIYaE6UIAL1dLeU</recordid><startdate>20240621</startdate><enddate>20240621</enddate><creator>SUN GUODONG</creator><creator>YE SHENGLONG</creator><scope>EVB</scope></search><sort><creationdate>20240621</creationdate><title>Light-weight high-heat-dissipation APU host structure</title><author>SUN GUODONG ; YE SHENGLONG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN221202960UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2024</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>SUN GUODONG</creatorcontrib><creatorcontrib>YE SHENGLONG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SUN GUODONG</au><au>YE SHENGLONG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Light-weight high-heat-dissipation APU host structure</title><date>2024-06-21</date><risdate>2024</risdate><abstract>The utility model discloses a light-weight high-heat-dissipation APU host structure. The APU host structure comprises an upper cover, a circuit board and a lower cover which are sequentially arranged from top to bottom, the upper cover comprises a front blocking piece, a heat dissipation piece and a rear blocking piece which are sequentially welded from front to back. A plurality of radiating fins are formed on the upper surface of the radiating piece by adopting an aluminum extrusion process; raised grains are formed on the surface, used for heat dissipation, of the heat dissipation piece; the circuit board is attached to the lower surface of the heat dissipation piece, and the front end and the rear end of the circuit board are limited by a front blocking piece and a rear blocking piece respectively. The front blocking piece is provided with a receding groove matched with an interface terminal of the circuit board. The lower cover is attached to the lower surface of the circuit board and is locked on the he</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | chi ; eng |
| recordid | cdi_epo_espacenet_CN221202960UU |
| source | esp@cenet |
| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | Light-weight high-heat-dissipation APU host structure |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-14T12%3A36%3A44IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=SUN%20GUODONG&rft.date=2024-06-21&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN221202960UU%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |