Light-weight high-heat-dissipation APU host structure

The utility model discloses a light-weight high-heat-dissipation APU host structure. The APU host structure comprises an upper cover, a circuit board and a lower cover which are sequentially arranged from top to bottom, the upper cover comprises a front blocking piece, a heat dissipation piece and a rear blocking piece which are sequentially welded from front to back. A plurality of radiating fins are formed on the upper surface of the radiating piece by adopting an aluminum extrusion process; raised grains are formed on the surface, used for heat dissipation, of the heat dissipation piece; the circuit board is attached to the lower surface of the heat dissipation piece, and the front end and the rear end of the circuit board are limited by a front blocking piece and a rear blocking piece respectively. The front blocking piece is provided with a receding groove matched with an interface terminal of the circuit board. The lower cover is attached to the lower surface of the circuit board and is locked on the he