LED flip chip

The embodiment of the utility model provides an LED flip chip, and belongs to the technical field of LED chips. The LED flip chip comprises two chips which are connected in parallel by the same substrate; every two adjacent chips are separated by a groove formed in the substrate; each chip comprises a bottom electrode structure and an epitaxial layer structure. According to the scheme of the utility model, aiming at the problems that the size of a substrate bonding pad is smaller and the welding strength of the chip is seriously influenced because the size of the chip is smaller and smaller in the existing scheme, the two chips are connected into a whole through the same substrate, so that the size of a single unit is increased, and the welding strength is improved. And two chips are integrated on one unit, so that the die bonding of the two chips can be executed at the same time, and the die bonding efficiency is improved on the whole. The problems of long die bonding time and low welding strength in the con