SEMICONDUCTOR DEVICE PACKAGE

The embodiment of the utility model relates to a semiconductor device package. According to some embodiments of the utility model, the adhesive layer can be formed above a part of a redistribution layer (RDL) in a redistribution structure of the semiconductor device package. The portion of the RDL over which the adhesive layer is formed may be positioned in a "shadow" of one or more TIVs connected to the redistribution layer structure (e.g., an area below and/or above the one or more TIVs and within a periphery of the one or more TIVs). The adhesive layer, along with a seed layer on which the portion of the RDL is formed, encapsulates the portion of the RDL in the shadow of the one or more TIVs, which promotes and/or increases adhesion between the portion of the RDL of the redistribution structure and a polymer layer. 本新型实施例涉及一种半导体装置封装。根据本实用新型的一些实施例，粘着层可形成于半导体装置封装的重布结构中的重布层RDL的部分上方。其上方形成所述粘着层的所述RDL的所述部分可定位于与所述重布层结构连接的一或多个TIV的"阴影"(例如在所述一或多个TIV下方及/或上方及在所述一或多个TIV的外围内的区域)中。所述粘着层连同其上形成所述RDL的所述部分的晶种层一起囊封所述一或多个TIV的所