TVS diode structure

The utility model discloses a TVS diode structure, which relates to the technical field of diodes and comprises a packaging shell, a lower flat copper ring is mounted at the inner bottom of the packaging shell, the lower part of the lower flat copper ring extends to the outside of the packaging shell, a first graphene coating is coated on the surface of the lower part of the lower flat copper ring, and a lead frame is mounted at the top of the lower flat copper ring. According to the TVS diode structure, the lower flat copper ring is attached to the bottom of the lead frame provided with the chip, the lower half portion of the lower flat copper ring is located at the bottom of the shell, the upper flat copper ring is attached to the upper surface of the chip, the upper half portion of the upper flat copper ring is located at the top of the shell, and when heat is generated in the diode, the larger the contact area between the flat copper rings and the chip is, the higher the heat conduction efficiency is. Thr