Wafer heat treatment gas circuit adjusting device

Wafer heat treatment gas circuit adjusting device

The utility model discloses a wafer heat treatment gas circuit adjusting device which comprises a first gas circuit assembly and a second gas circuit assembly, the first gas circuit assembly is provided with a plurality of first gas holes, the second gas circuit assembly is provided with a plurality...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: GENG WEI, HUANG ZHULONG, GU SHAOJUN
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator GENG WEI
HUANG ZHULONG
GU SHAOJUN
description The utility model discloses a wafer heat treatment gas circuit adjusting device which comprises a first gas circuit assembly and a second gas circuit assembly, the first gas circuit assembly is provided with a plurality of first gas holes, the second gas circuit assembly is provided with a plurality of second gas holes, the first gas holes and the second gas holes are long kidney-shaped holes, and the first gas holes are communicated with the second gas holes. A plurality of limiting grooves are formed in the first gas path assembly, and a plurality of sliding blocks are arranged on the second gas path assembly; the device is simple in structure, novel in design and convenient and fast to operate, the flow of process gas in a gas path can be adjusted, and the working efficiency is improved. 本实用新型公开了一种晶圆片热处理气路调节装置，包括第一气路组件与第二气路组件，所述第一气路组件上设有多个第一气孔，所述第二气路组件上设有多个第二气孔，所述第一气孔与第二气孔均为长腰孔，所述第一气路组件上设有多个限位槽，所述第二气路组件上设有多个滑块；本实用新型结构简单，设计新颖，可实现气路内工艺气体流量的调节，操作方便快捷，提高了工作效率。
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN221201096UU</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN221201096UU</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN221201096UU3</originalsourceid><addsrcrecordid>eNrjZDAMT0xLLVLISE0sUSgpApK5qXklCumJxQrJmUXJpZklCokpWaXFJZl56QopqWWZyak8DKxpiTnFqbxQmptByc01xNlDN7UgPz61uCAxOTUvtSTe2c_IyNDIwNDA0iw01JgoRQDsBSxs</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Wafer heat treatment gas circuit adjusting device</title><source>esp@cenet</source><creator>GENG WEI ; HUANG ZHULONG ; GU SHAOJUN</creator><creatorcontrib>GENG WEI ; HUANG ZHULONG ; GU SHAOJUN</creatorcontrib><description>The utility model discloses a wafer heat treatment gas circuit adjusting device which comprises a first gas circuit assembly and a second gas circuit assembly, the first gas circuit assembly is provided with a plurality of first gas holes, the second gas circuit assembly is provided with a plurality of second gas holes, the first gas holes and the second gas holes are long kidney-shaped holes, and the first gas holes are communicated with the second gas holes. A plurality of limiting grooves are formed in the first gas path assembly, and a plurality of sliding blocks are arranged on the second gas path assembly; the device is simple in structure, novel in design and convenient and fast to operate, the flow of process gas in a gas path can be adjusted, and the working efficiency is improved. 本实用新型公开了一种晶圆片热处理气路调节装置，包括第一气路组件与第二气路组件，所述第一气路组件上设有多个第一气孔，所述第二气路组件上设有多个第二气孔，所述第一气孔与第二气孔均为长腰孔，所述第一气路组件上设有多个限位槽，所述第二气路组件上设有多个滑块；本实用新型结构简单，设计新颖，可实现气路内工艺气体流量的调节，操作方便快捷，提高了工作效率。</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240621&amp;DB=EPODOC&amp;CC=CN&amp;NR=221201096U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25544,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240621&amp;DB=EPODOC&amp;CC=CN&amp;NR=221201096U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>GENG WEI</creatorcontrib><creatorcontrib>HUANG ZHULONG</creatorcontrib><creatorcontrib>GU SHAOJUN</creatorcontrib><title>Wafer heat treatment gas circuit adjusting device</title><description>The utility model discloses a wafer heat treatment gas circuit adjusting device which comprises a first gas circuit assembly and a second gas circuit assembly, the first gas circuit assembly is provided with a plurality of first gas holes, the second gas circuit assembly is provided with a plurality of second gas holes, the first gas holes and the second gas holes are long kidney-shaped holes, and the first gas holes are communicated with the second gas holes. A plurality of limiting grooves are formed in the first gas path assembly, and a plurality of sliding blocks are arranged on the second gas path assembly; the device is simple in structure, novel in design and convenient and fast to operate, the flow of process gas in a gas path can be adjusted, and the working efficiency is improved. 本实用新型公开了一种晶圆片热处理气路调节装置，包括第一气路组件与第二气路组件，所述第一气路组件上设有多个第一气孔，所述第二气路组件上设有多个第二气孔，所述第一气孔与第二气孔均为长腰孔，所述第一气路组件上设有多个限位槽，所述第二气路组件上设有多个滑块；本实用新型结构简单，设计新颖，可实现气路内工艺气体流量的调节，操作方便快捷，提高了工作效率。</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDAMT0xLLVLISE0sUSgpApK5qXklCumJxQrJmUXJpZklCokpWaXFJZl56QopqWWZyak8DKxpiTnFqbxQmptByc01xNlDN7UgPz61uCAxOTUvtSTe2c_IyNDIwNDA0iw01JgoRQDsBSxs</recordid><startdate>20240621</startdate><enddate>20240621</enddate><creator>GENG WEI</creator><creator>HUANG ZHULONG</creator><creator>GU SHAOJUN</creator><scope>EVB</scope></search><sort><creationdate>20240621</creationdate><title>Wafer heat treatment gas circuit adjusting device</title><author>GENG WEI ; HUANG ZHULONG ; GU SHAOJUN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN221201096UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>GENG WEI</creatorcontrib><creatorcontrib>HUANG ZHULONG</creatorcontrib><creatorcontrib>GU SHAOJUN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>GENG WEI</au><au>HUANG ZHULONG</au><au>GU SHAOJUN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Wafer heat treatment gas circuit adjusting device</title><date>2024-06-21</date><risdate>2024</risdate><abstract>The utility model discloses a wafer heat treatment gas circuit adjusting device which comprises a first gas circuit assembly and a second gas circuit assembly, the first gas circuit assembly is provided with a plurality of first gas holes, the second gas circuit assembly is provided with a plurality of second gas holes, the first gas holes and the second gas holes are long kidney-shaped holes, and the first gas holes are communicated with the second gas holes. A plurality of limiting grooves are formed in the first gas path assembly, and a plurality of sliding blocks are arranged on the second gas path assembly; the device is simple in structure, novel in design and convenient and fast to operate, the flow of process gas in a gas path can be adjusted, and the working efficiency is improved. 本实用新型公开了一种晶圆片热处理气路调节装置，包括第一气路组件与第二气路组件，所述第一气路组件上设有多个第一气孔，所述第二气路组件上设有多个第二气孔，所述第一气孔与第二气孔均为长腰孔，所述第一气路组件上设有多个限位槽，所述第二气路组件上设有多个滑块；本实用新型结构简单，设计新颖，可实现气路内工艺气体流量的调节，操作方便快捷，提高了工作效率。</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language chi ; eng
recordid cdi_epo_espacenet_CN221201096UU
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Wafer heat treatment gas circuit adjusting device
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-28T01%3A32%3A40IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=GENG%20WEI&rft.date=2024-06-21&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN221201096UU%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true