Wafer heat treatment gas circuit adjusting device

The utility model discloses a wafer heat treatment gas circuit adjusting device which comprises a first gas circuit assembly and a second gas circuit assembly, the first gas circuit assembly is provided with a plurality of first gas holes, the second gas circuit assembly is provided with a plurality of second gas holes, the first gas holes and the second gas holes are long kidney-shaped holes, and the first gas holes are communicated with the second gas holes. A plurality of limiting grooves are formed in the first gas path assembly, and a plurality of sliding blocks are arranged on the second gas path assembly; the device is simple in structure, novel in design and convenient and fast to operate, the flow of process gas in a gas path can be adjusted, and the working efficiency is improved. 本实用新型公开了一种晶圆片热处理气路调节装置，包括第一气路组件与第二气路组件，所述第一气路组件上设有多个第一气孔，所述第二气路组件上设有多个第二气孔，所述第一气孔与第二气孔均为长腰孔，所述第一气路组件上设有多个限位槽，所述第二气路组件上设有多个滑块；本实用新型结构简单，设计新颖，可实现气路内工艺气体流量的调节，操作方便快捷，提高了工作效率。