Semiconductor heat treatment equipment

The utility model provides semiconductor heat treatment equipment, including reaction chamber, sealing door structure, rotation driving mechanism and heating part, sealing door structure and reaction chamber seal fit, rotation driving mechanism passes through sealing door structure and is used for b...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: YANG SHUAI, HUANG MINTAO, GAO SHANG
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The utility model provides semiconductor heat treatment equipment, including reaction chamber, sealing door structure, rotation driving mechanism and heating part, sealing door structure and reaction chamber seal fit, rotation driving mechanism passes through sealing door structure and is used for bearing and driving the boat in reaction chamber to rotate, and heating part passes through rotation driving mechanism and is used for bearing and driving the boat in reaction chamber to rotate. And the heating component is arranged in the reaction chamber, is fixedly connected with the rotation driving mechanism, does not rotate along with the rotation of the wafer boat driven by the rotation driving mechanism, and is used for heating the wafer carried by the wafer boat in the reaction chamber. According to the semiconductor heat treatment equipment provided by the embodiment of the utility model, the uniformity of process results among a plurality of wafers can be improved, and the space utilization rate and the p