Auxiliary device for analyzing and detecting metal content of wafer

Auxiliary device for analyzing and detecting metal content of wafer

The utility model relates to the technical field of wafer detection, in particular to an auxiliary device for analyzing and detecting the metal content of a wafer. According to the technical scheme, the device comprises a vertical box, a side box and a second clamping roller, a two-way screw rod pen...

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Hauptverfasser: CAI XINCHUN, WEI SHENG
Format: Patent
Sprache:chi ; eng
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INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES
MEASURING
MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE
PHYSICS
TESTING
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creator CAI XINCHUN
WEI SHENG
description The utility model relates to the technical field of wafer detection, in particular to an auxiliary device for analyzing and detecting the metal content of a wafer. According to the technical scheme, the device comprises a vertical box, a side box and a second clamping roller, a two-way screw rod penetrating through the vertical box is rotationally installed in the side box, two sets of screw sleeves are installed on the outer side of the two-way screw rod in a threaded mode, a clamping base is fixedly installed on the front face of one set of screw sleeves, and a pressure sensor is embedded in the clamping base; a connecting base is installed on one side of the clamping base through cooperation of a connecting rod and the connecting hole, and a first clamping roller is rotationally installed on the front face of the connecting base. The clamping force of the first clamping roller on the wafer body is monitored in real time through the pressure sensor, a monitoring electric signal is transmitted to the control
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subjects INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES
MEASURING
MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE
PHYSICS
TESTING
title Auxiliary device for analyzing and detecting metal content of wafer
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