Jig structure for selective silver plating of SiC power module

The utility model provides a jig structure for selective silver plating of a SiC power module, which comprises a main board provided with a groove for accommodating the power module; the cover plate and the mainboard are mutually buckled and installed, and the cover plate is provided with a silver plating channel corresponding to the metal surface on the power module; one end of the conductive device is connected to the mainboard, and the other end of the conductive device elastically abuts against the metal surface corresponding to the silver plating channel, so that the metal surface is electrically connected; wherein a sealing assembly is arranged between the main board and the cover plate, and the sealing assembly forms a sealed space so as to seal the power module corresponding to the outer side of the metal surface. The selective electroplating device is simple in structure, convenient to disassemble and assemble and capable of realizing selective electroplating without negative effects on products. 本实用