Wafer grinding pad

The utility model provides a wafer grinding pad, which is applied to the technical field of wafer grinding, and comprises a pad body, the pad body is circular, the grinding pad is provided with a plurality of annular grooves, the annular grooves are concentrically arranged, the circle center of each annular groove is the circle center of the pad body, and the circle center of each annular groove is the circle center of the pad body. A plurality of friction grooves are formed in the side, away from the circle center, of the annular groove on the outermost side of the circle center, one end of each friction groove communicates with the annular groove on the outermost side of the circle center, and the ends, away from the annular grooves, of the friction grooves are close to the outer side wall of the pad body. When the wafer needs to be ground, grinding liquid is dropped into the annular groove and the friction groove of the pad body, the grinding head drives the wafer to rotate and move, the wafer makes contac