Device for testing bending strength of silicon wafer

The utility model belongs to the technical field of silicon wafer testing, and particularly relates to a device for testing the bending strength of a silicon wafer, which comprises a support and the silicon wafer, and further comprises two groups of bearing assemblies used for bearing the silicon wafer and a pressing assembly used for simultaneously extruding the two groups of silicon wafers, the pressing assembly is arranged on the support, and the two groups of bearing assemblies are arranged on the support. The support comprises a side plate, supporting plates are fixedly installed at the two ends of one side of the side plate, and the partition plate is fixedly installed on one side of the side plate. The problem that an existing device for testing the bending strength of the silicon wafers can only test one group of silicon wafers each time can be solved, so that the testing efficiency of the silicon wafers can be improved to a certain extent, and the cost investment can be reduced to a certain extent. 本