Thermal diffusion device and electronic apparatus
The utility model relates to a thermal diffusion device and electronic equipment. A vapor chamber (1A), which is an embodiment of a heat diffusion device, is provided with: a housing (10) having a first inner wall surface (11a) and a second inner wall surface (12a) facing each other in the thickness...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The utility model relates to a thermal diffusion device and electronic equipment. A vapor chamber (1A), which is an embodiment of a heat diffusion device, is provided with: a housing (10) having a first inner wall surface (11a) and a second inner wall surface (12a) facing each other in the thickness direction Z; a working medium (20) sealed in the internal space of the housing (10); and a core (30) disposed between the first inner wall surface (11a) and the second inner wall surface (12a) of the housing (10). The core (30) is configured from a fiber bundle in which fibers F are bundled in a linear shape. Between the core (30) and at least one of the first inner wall surface (11a) and the second inner wall surface (12a), a liquid flow path (41) and/or a liquid flow path (42) based on capillary force is formed along the extension direction of the core (30).
本实用新型涉及一种热扩散器件以及电子设备,作为热扩散器件的一个实施方式的蒸汽腔(1A)具备:具有在厚度方向Z上对置的第一内壁面(11a)和第二内壁面(12a)的壳体(10)、封入壳体(10)的内部空间的工作介质(20)、以及配置在壳体(10)的第一内壁面(11a)与第二内壁面(12a)之间的芯体(30)。芯体( |
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