Bipolar plate feeding mechanism

The utility model discloses a bipolar plate feeding mechanism which comprises a conveying assembly and a vacuum adsorption assembly, the vacuum adsorption assembly is arranged on the conveying assembly, and the conveying assembly can drive the vacuum adsorption assembly to move front and back. And t...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: RUAN KAICANG, CHEN XING, ZHA JIN
Format: Patent
Sprache:chi ; eng
Schlagworte:
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Beschreibung
Zusammenfassung:The utility model discloses a bipolar plate feeding mechanism which comprises a conveying assembly and a vacuum adsorption assembly, the vacuum adsorption assembly is arranged on the conveying assembly, and the conveying assembly can drive the vacuum adsorption assembly to move front and back. And the flattening assembly is installed on the frame, and the flattening assembly is located above the conveying assembly. According to the bipolar plate feeding device, the flattening assembly and the vacuum adsorption assembly are matched with each other, so that the flatness of the bipolar plate during feeding can be ensured, and the subsequent dispensing precision can be improved. 本实用新型公开了一种双极板的上料机构,包括:输送组件,以及真空吸附组件,真空吸附组件设置在输送组件上,输送组件能够带动真空吸附组件前后移动;压平组件,压平组件安装在框架上,压平组件位于输送组件的上方。本实用新型通过压平组件和真空吸附组件的相互配合,能够保证双极板上料时的平整度,有利于提高后续的点胶精度。