Circuit board for LED module and corresponding steel mesh thereof
According to the circuit board for the LED module and the corresponding steel mesh, the circuit board comprises a substrate and a copper column, the copper column comprises a column body and a welding part formed at the bottom of the column body, a bonding pad is arranged on the substrate, a positio...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | According to the circuit board for the LED module and the corresponding steel mesh, the circuit board comprises a substrate and a copper column, the copper column comprises a column body and a welding part formed at the bottom of the column body, a bonding pad is arranged on the substrate, a positioning hole is formed in the bottom of the bonding pad, a positioning column is arranged on the side, opposite to the column body, of the welding part, and the positioning hole is formed in the bottom of the bonding pad. The diameter of the positioning column is matched with that of the positioning hole; wherein the bonding pad comprises a plurality of sub-bonding pads, the plurality of sub-bonding pads are arranged at intervals and surround the outer side of the positioning hole, and each sub-bonding pad is provided with solder paste coated by a steel mesh, so that the welding part can be correspondingly connected to the sub-bonding pad through the solder paste.
一种用于LED模组的电路板及其对应的钢网,所述电路板包括基板和铜柱,所述铜柱包括柱体和形成在柱体底部的焊接部 |
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