Package

The present disclosure provides a package including an encapsulant, a sealant, an adhesive, and a cover. The encapsulant laterally surrounds the first integrated circuit device and the second integrated circuit device, wherein the first integrated circuit device includes a die and a heat dissipation structure over the die; the sealant is arranged above the heat dissipation structure; the adhesive is disposed over the second integrated circuit device. The cover member is arranged above the sealant and the adhesive, the cover member comprises a first cooling passage and a second cooling passage, the first cooling passage comprises an opening, is positioned at the bottom of the cover member and is aligned with the heat dissipation structure, and the second cooling passage comprises a plurality of channels which are aligned with the second cooling passage and are far away from the bottom of the cover member. 本公开提供一种封装体，包括封装剂、密封剂、黏着剂以及盖件。封装剂横向包围第一集成电路装置以及第二集成电路装置，其中第一集成电路装置包括管芯以及位于管芯上方的散热结构；密封剂设置于散热结构上方；黏着剂设置于第二集成