Wafer heat treatment cavity device

The utility model discloses a wafer heat treatment cavity device which comprises a heating box, the top of the heating box is fixedly provided with a laser emission head, the inner wall of the heating box is fixedly connected with a fixed plate, the inner side of the fixed plate is rotatably provided with a rotating plate, and the inner side of the rotating plate is movably provided with a clamping block. And threaded rods are in threaded connection with the interiors of the clamping blocks. According to the wafer heat treatment cavity device, a wafer is placed at the top of the rotating plate, clamping blocks are moved through rotation of threaded rods to clamp and fix the wafer, then when a laser emission head emits laser to the wafer to heat the wafer, a shaft column is driven to rotate through a fixing motor, the rotating plate drives the wafer to rotate and heat, and the wafer is heated through the rotating plate. Therefore, the occupied area of the heating structure is reduced, meanwhile, heat treatment