Equipment for laminating resin-coated copper material layer on substrate panel

The utility model provides equipment for laminating a resin-coated copper material layer onto a substrate panel, the equipment comprises at least one resin-coated copper material feeding system, and the resin-coated copper material feeding system comprises a resin-coated copper material supply device, a release film removing device, an attaching device and a copper material cutting device which are arranged in a complete set; the equipment further comprises a substrate panel conveying device and a laminating device, the attaching device comprises an attaching surface enabling the resin-coated copper material guided to the attaching device to be attached to the attaching device, the attaching surface comprises a working area and a non-working area, the working area is provided with holes, and the non-working area is provided with holes. The attachment surface adsorbs the resin-coated copper material to the attachment surface through a hole to which a negative pressure is applied, and the laminating device incl