Chip-on-wafer device structure on substrate

A chip-on-wafer-on-substrate (CoWoS) device structure is provided, including: a package substrate; an interposer over the package substrate; a first die and a second die disposed on the interposer, where the first die has a first bottom surface and the second die has a second bottom surface, where a plane coplanar with the first bottom surface and the second bottom surface has a slope greater than zero, and where the first die is spaced from the second die at a first edge of the first die by a first distance, a second distance is spaced from the second crystal grain at a second edge of the first crystal grain, the second edge is opposite to the first edge, and the first distance is equal to the second distance. 提供一种基板上晶圆上芯片(CoWoS)装置结构，包括：封装基板；中介层，在封装基板上方；第一晶粒与第二晶粒，设置在中介层上，其中第一晶粒具有第一底表面且第二晶粒具有第二底表面，其中与第一底表面和第二底表面共平面的平面具有大于零的斜率，且其中第一晶粒在第一晶粒的第一边缘处与第二晶粒间隔第一距离，且在第一晶粒的第二边缘处与第二晶粒间隔第二距离，第二边缘与第一边缘相对，且其中第一距离等于第二距离。