Flat-pin surface-mounted diode with glue-blocking lead frame structure
The utility model relates to a flat pin SMD (Surface Mount Device) diode with a glue-blocking lead frame structure, which comprises a packaging body, and a lead frame and a chip which are coated in the packaging body, the lead frame comprises a pin section arranged at a lower position, a connecting...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The utility model relates to a flat pin SMD (Surface Mount Device) diode with a glue-blocking lead frame structure, which comprises a packaging body, and a lead frame and a chip which are coated in the packaging body, the lead frame comprises a pin section arranged at a lower position, a connecting section arranged at a higher position and a bending section used for connecting the pin section and the connecting section, the connecting section is electrically connected to the chip, the pin section extends outwards from the interior of the packaging body to serve as a pin, and the lower surface of the pin section is flush with the lower surface of the packaging body; a bottom plane higher than the lower surface of the pin section is formed at the lower end of the bending section, a vertical plane is formed at the inner end, located in the packaging body, of the pin section, the vertical plane extends to the lower surface of the pin section from the bottom plane and is perpendicular to the lower surface of the p |
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