Brushing device for wafer
The utility model relates to the field of semiconductor manufacturing, in particular to a brushing device for a wafer, and provides the brushing device for the wafer, which has the advantages that the edge of a brush head is not easy to deviate and the brushing effect is not influenced. The scrubbin...
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| creator | OUYANG GAOJIAN JIN CONGLONG TIAN XIAOQIANG WEN GUOSHENG CUI SIYUAN |
| description | The utility model relates to the field of semiconductor manufacturing, in particular to a brushing device for a wafer, and provides the brushing device for the wafer, which has the advantages that the edge of a brush head is not easy to deviate and the brushing effect is not influenced. The scrubbing device comprises a support and a plurality of sliding rods arranged on the support, sliding blocks are connected between the sliding rods in a sliding mode, a first motor is arranged on the sliding blocks, and a first mounting plate is connected to an output shaft of the first motor. The first metal beads are arranged in the first hundred-grade cleaning cloth in a filling mode, so that in the long-time scrubbing work process, due to the fact that the first metal beads are not prone to deformation, the brush head composed of the first hundred-grade cleaning cloth and the first metal beads is not prone to deformation, the edge cannot deviate, the scrubbing effect is not affected, and the service life of the brush h |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN221057376UU</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN221057376UU</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN221057376UU3</originalsourceid><addsrcrecordid>eNrjZJB0KiotzsjMS1dISS3LTE5VSMsvUihPTEst4mFgTUvMKU7lhdLcDEpuriHOHrqpBfnxqcUFicmpeakl8c5-RkaGBqbmxuZmoaHGRCkCAFd8I0Q</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Brushing device for wafer</title><source>esp@cenet</source><creator>OUYANG GAOJIAN ; JIN CONGLONG ; TIAN XIAOQIANG ; WEN GUOSHENG ; CUI SIYUAN</creator><creatorcontrib>OUYANG GAOJIAN ; JIN CONGLONG ; TIAN XIAOQIANG ; WEN GUOSHENG ; CUI SIYUAN</creatorcontrib><description>The utility model relates to the field of semiconductor manufacturing, in particular to a brushing device for a wafer, and provides the brushing device for the wafer, which has the advantages that the edge of a brush head is not easy to deviate and the brushing effect is not influenced. The scrubbing device comprises a support and a plurality of sliding rods arranged on the support, sliding blocks are connected between the sliding rods in a sliding mode, a first motor is arranged on the sliding blocks, and a first mounting plate is connected to an output shaft of the first motor. The first metal beads are arranged in the first hundred-grade cleaning cloth in a filling mode, so that in the long-time scrubbing work process, due to the fact that the first metal beads are not prone to deformation, the brush head composed of the first hundred-grade cleaning cloth and the first metal beads is not prone to deformation, the edge cannot deviate, the scrubbing effect is not affected, and the service life of the brush h</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; CLEANING ; CLEANING IN GENERAL ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; PERFORMING OPERATIONS ; PREVENTION OF FOULING IN GENERAL ; SEMICONDUCTOR DEVICES ; TRANSPORTING</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240531&DB=EPODOC&CC=CN&NR=221057376U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240531&DB=EPODOC&CC=CN&NR=221057376U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>OUYANG GAOJIAN</creatorcontrib><creatorcontrib>JIN CONGLONG</creatorcontrib><creatorcontrib>TIAN XIAOQIANG</creatorcontrib><creatorcontrib>WEN GUOSHENG</creatorcontrib><creatorcontrib>CUI SIYUAN</creatorcontrib><title>Brushing device for wafer</title><description>The utility model relates to the field of semiconductor manufacturing, in particular to a brushing device for a wafer, and provides the brushing device for the wafer, which has the advantages that the edge of a brush head is not easy to deviate and the brushing effect is not influenced. The scrubbing device comprises a support and a plurality of sliding rods arranged on the support, sliding blocks are connected between the sliding rods in a sliding mode, a first motor is arranged on the sliding blocks, and a first mounting plate is connected to an output shaft of the first motor. The first metal beads are arranged in the first hundred-grade cleaning cloth in a filling mode, so that in the long-time scrubbing work process, due to the fact that the first metal beads are not prone to deformation, the brush head composed of the first hundred-grade cleaning cloth and the first metal beads is not prone to deformation, the edge cannot deviate, the scrubbing effect is not affected, and the service life of the brush h</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CLEANING</subject><subject>CLEANING IN GENERAL</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>PERFORMING OPERATIONS</subject><subject>PREVENTION OF FOULING IN GENERAL</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJB0KiotzsjMS1dISS3LTE5VSMsvUihPTEst4mFgTUvMKU7lhdLcDEpuriHOHrqpBfnxqcUFicmpeakl8c5-RkaGBqbmxuZmoaHGRCkCAFd8I0Q</recordid><startdate>20240531</startdate><enddate>20240531</enddate><creator>OUYANG GAOJIAN</creator><creator>JIN CONGLONG</creator><creator>TIAN XIAOQIANG</creator><creator>WEN GUOSHENG</creator><creator>CUI SIYUAN</creator><scope>EVB</scope></search><sort><creationdate>20240531</creationdate><title>Brushing device for wafer</title><author>OUYANG GAOJIAN ; JIN CONGLONG ; TIAN XIAOQIANG ; WEN GUOSHENG ; CUI SIYUAN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN221057376UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CLEANING</topic><topic>CLEANING IN GENERAL</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>PERFORMING OPERATIONS</topic><topic>PREVENTION OF FOULING IN GENERAL</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>OUYANG GAOJIAN</creatorcontrib><creatorcontrib>JIN CONGLONG</creatorcontrib><creatorcontrib>TIAN XIAOQIANG</creatorcontrib><creatorcontrib>WEN GUOSHENG</creatorcontrib><creatorcontrib>CUI SIYUAN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>OUYANG GAOJIAN</au><au>JIN CONGLONG</au><au>TIAN XIAOQIANG</au><au>WEN GUOSHENG</au><au>CUI SIYUAN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Brushing device for wafer</title><date>2024-05-31</date><risdate>2024</risdate><abstract>The utility model relates to the field of semiconductor manufacturing, in particular to a brushing device for a wafer, and provides the brushing device for the wafer, which has the advantages that the edge of a brush head is not easy to deviate and the brushing effect is not influenced. The scrubbing device comprises a support and a plurality of sliding rods arranged on the support, sliding blocks are connected between the sliding rods in a sliding mode, a first motor is arranged on the sliding blocks, and a first mounting plate is connected to an output shaft of the first motor. The first metal beads are arranged in the first hundred-grade cleaning cloth in a filling mode, so that in the long-time scrubbing work process, due to the fact that the first metal beads are not prone to deformation, the brush head composed of the first hundred-grade cleaning cloth and the first metal beads is not prone to deformation, the edge cannot deviate, the scrubbing effect is not affected, and the service life of the brush h</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | BASIC ELECTRIC ELEMENTS CLEANING CLEANING IN GENERAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS PREVENTION OF FOULING IN GENERAL SEMICONDUCTOR DEVICES TRANSPORTING |
| title | Brushing device for wafer |
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