Brushing device for wafer

The utility model relates to the field of semiconductor manufacturing, in particular to a brushing device for a wafer, and provides the brushing device for the wafer, which has the advantages that the edge of a brush head is not easy to deviate and the brushing effect is not influenced. The scrubbing device comprises a support and a plurality of sliding rods arranged on the support, sliding blocks are connected between the sliding rods in a sliding mode, a first motor is arranged on the sliding blocks, and a first mounting plate is connected to an output shaft of the first motor. The first metal beads are arranged in the first hundred-grade cleaning cloth in a filling mode, so that in the long-time scrubbing work process, due to the fact that the first metal beads are not prone to deformation, the brush head composed of the first hundred-grade cleaning cloth and the first metal beads is not prone to deformation, the edge cannot deviate, the scrubbing effect is not affected, and the service life of the brush h