Electrostatic chuck and wafer etching system

The utility model relates to the technical field of semiconductors, and provides an electrostatic chuck and a wafer etching system, the electrostatic chuck comprises a ceramic adsorption layer and a metal base, the ceramic adsorption layer and the metal base are connected in an edge welding mode, and an isolation cavity is formed between the ceramic adsorption layer and the metal base; an electrostatic electrode layer and a first heating electrode layer are arranged in the ceramic adsorption layer; a first component and a second component are arranged in the metal base, and both the first component and the second component penetrate through the metal base; the electrostatic electrode layer is connected and conducted with the first component; and the first heating electrode layer is connected and conducted with the second part. According to the electrostatic chuck, the ceramic adsorption layer and the metal base are connected in an edge welding mode, the scheme that a colloid adhesive is used for integrated pr