Heat conduction and dissipation device for high-power circuit board in sealed case
The utility model belongs to the technical field of navigation equipment design, and relates to a heat conduction and dissipation device for a high-power circuit board in a sealed case. Comprising a sealed case (1), a high-power circuit board (2) and a locking strip (7), longitudinal symmetrical bos...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The utility model belongs to the technical field of navigation equipment design, and relates to a heat conduction and dissipation device for a high-power circuit board in a sealed case. Comprising a sealed case (1), a high-power circuit board (2) and a locking strip (7), longitudinal symmetrical bosses are arranged on the two sides of an inner cavity of the sealing machine box (1), and the high-power circuit board (2) is arranged in the sealing machine box (1) and installed with the inner cavity of the sealing machine box (1) in a pressing fit and sealing mode through two pairs of locking strips (7). According to the utility model, the convenience of plugging maintenance of the high-power circuit is kept, more conduction heat dissipation ways are added, multiple measures can be implemented in parallel, and finally, the heat dissipation requirement of the high-power circuit board in the sealed case is met.
本实用新型属于导航设备设计技术领域,涉及一种密封机箱内大功率电路板导散热装置。包括密封机箱(1)、大功率电路板(2),锁紧条(7);所述密封机箱(1)内腔两侧具有纵向对称凸台,所述大功率电路板(2)设置于所述密 |
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