Optical coupler chip plastic package structure
The utility model relates to an optocoupler chip plastic package structure, which comprises a lead frame unit and a plastic package body, the lead frame unit comprises a first outer pin, a second outer pin, a third outer pin, a fourth outer pin, a fifth outer pin, a sixth outer pin and a seventh out...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The utility model relates to an optocoupler chip plastic package structure, which comprises a lead frame unit and a plastic package body, the lead frame unit comprises a first outer pin, a second outer pin, a third outer pin, a fourth outer pin, a fifth outer pin, a sixth outer pin and a seventh outer pin, the first outer pin is connected with a first slide island for installing a photosensitive chip, and the third outer pin is connected with a second slide island for installing a control chip. The fourth outer pin and the fifth outer pin are connected with a third slide island for installing a light-emitting chip, a first boss is arranged at the inner end of the sixth outer pin, a first bonding area is arranged on the first boss and connected with the light-emitting chip through a bonding wire, the first slide island and the second slide island are adjacently arranged, and a second bonding area and a third bonding area are arranged on the second slide island and located on one side of the first slide island. |
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