Chip packaging structure and radio frequency module device

The utility model relates to a chip packaging structure and a radio frequency module device. The chip packaging structure comprises a substrate, a plurality of chips arranged on the substrate, an electromagnetic shielding wall which is arranged on the substrate and is used for isolating interference...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	XU CHAOSHENG, SUN DUO, YE SHIFEN, ZHAO XINGEN, WANG ERLEI, ZHANG CHAO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRONIC CIRCUITRY ELECTRICITY IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS RESONATORS
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