Chip packaging structure and radio frequency module device

The utility model relates to a chip packaging structure and a radio frequency module device. The chip packaging structure comprises a substrate, a plurality of chips arranged on the substrate, an electromagnetic shielding wall which is arranged on the substrate and is used for isolating interference signals among the plurality of chips, a protective film which covers the plurality of chips, the substrate and part of the electromagnetic shielding wall, a plastic packaging body which is formed on the substrate and covers the protective film, and an outer shielding layer which is arranged on the outer surface of the plastic packaging body, the plurality of chips comprise a filter chip, and a cavity is defined by the protective film, the filter chip and the substrate; the plastic package body packages the plurality of chips and the electromagnetic shielding wall; and the outer shielding layer is electrically connected with the electromagnetic shielding wall. According to the chip packaging structure, the electrom