Integrated chip and semiconductor structure

The utility model provides an integrated chip comprising an extending through hole and a semiconductor structure. The extending through hole spans the combined height of a wire and a through hole and has a smaller occupied area than the wire. The extended vias may replace the wires and adjacent vias...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LIN XINGZHI, WANG MINGCONG, YANG DUNNIAN, LIN MENGXIAN, GAO MINFENG, LIN GUANHUA, LIU RENCHENG, LIU KEQUN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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