Multi-optical-path imaging device applied after chip die bonding and bonding

The utility model discloses a multi-light-path imaging device applied after chip die bonding and bonding, which comprises a camera, a lens and a combined light source which are sequentially and coaxially arranged, the combined light source at least comprises a coaxial light source used for uniformly...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HUANG XIUJIN, CHEN HONGMING
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING PHYSICS TESTING
Online-Zugang:	Volltext bestellen
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