Multi-optical-path imaging device applied after chip die bonding and bonding

The utility model discloses a multi-light-path imaging device applied after chip die bonding and bonding, which comprises a camera, a lens and a combined light source which are sequentially and coaxially arranged, the combined light source at least comprises a coaxial light source used for uniformly illuminating a core particle, a first annular light source used for vertically irradiating the core particle and a bonding wire for imaging light supplement after die bonding and bonding, and a gold thread light source used for illuminating a gold thread after bonding, and the first annular light source is arranged at the outer side of the coaxial light source; the gold thread light source is obliquely arranged and located on the outer side of the first annular light source. Illumination of the combined light source separates the imaging effect of the core particles from the imaging effect of the gold threads, the imaging contrast ratio is improved, chip imaging of the two process sections of die bonding and bondi