BGA device weldability test fixture

The utility model discloses a BGA (Ball Grid Array) device weldability test fixture, which comprises a magnetic suction head, a fixture rod arranged below the magnetic suction head, an annular rotating shaft arranged below the fixture rod, a fixed rod fixedly connected below the annular rotating sha...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: DENG HAO, YUAN YUNHUA, LU YANG, WANG BOCHUN, TIAN JIAN, YANG FAN, ZHANG YONG, WANG RUISONG, MA QINGTAO
Format: Patent
Sprache:chi ; eng
Schlagworte:
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Beschreibung
Zusammenfassung:The utility model discloses a BGA (Ball Grid Array) device weldability test fixture, which comprises a magnetic suction head, a fixture rod arranged below the magnetic suction head, an annular rotating shaft arranged below the fixture rod, a fixed rod fixedly connected below the annular rotating shaft, a guide ring sleeved on the fixed rod, three connecting blocks uniformly arranged below the guide ring, and connecting plates arranged on two sides of each connecting block, the two connecting plates are movably connected with the connecting block through pin shafts, the lower ends of the two connecting plates are movably connected with the fixing claw through pin shafts, a limiting rod is arranged on the side, close to the fixing rod, of the fixing claw, the middle of the lower portion of the fixing rod is fixedly connected with the connecting rod, the lower portion of the connecting rod is fixedly connected with the fixing plate, and three mounting plates are evenly arranged below the fixing plate. The sides,