Integrated circuit package

An integrated circuit package is provided that includes an interposer including a first redistribution layer, a second redistribution layer over the first redistribution layer in a central region of the interposer, a dielectric layer over the first redistribution layer in a periphery of the interposer, a third redistribution layer over the first redistribution layer in a peripheral region of the interposer, and a first direct via. A dielectric layer surrounds the second redistribution layer in a top view, a third redistribution layer over the second redistribution layer and the dielectric layer, and a first direct via extending through the dielectric layer. The conductive feature of the third redistribution layer is coupled to the conductive feature of the first redistribution layer through a first direct via. 提供一种集成电路封装体，包括中介层，中介层包括第一重分布层、第二重分布层、介电层、第三重分布层以及第一直接通孔，第二重分布层在中介层的中央区域中的第一重分布层之上，介电层在中介层的周边中的第一重分布层之上，介电层在俯视图中围绕第二重分布层，第三重分布层在第二重分布层以及介电层之上，第一直接通孔延伸通过介电层。第三重分布层的导电特征通过第一直接通孔耦接到第一重分布层的导电特征。