Electromigration test structure

The utility model relates to the field of semiconductor process reliability testing, and discloses an electromigration testing structure which comprises at least one testing module. The test module comprises a to-be-tested wire, a first lead, a second lead, a first through hole, a second through hole, a first test end, a second test end and at least one third test end; a to-be-tested wire is electrically connected with the first lead wire through the first through hole, and is electrically connected with the second lead wire through the second through hole; the first test end is electrically connected with the first lead, the second test end is electrically connected with the second lead, and the third test end is electrically connected with the to-be-tested wire. According to the application, at least one third test end is led out from the to-be-tested line, and the third test end is combined with the first test end and the second test end, so that the resistors at different positions in the electromigration