Cutting and conveying device for copper plate machining

The utility model relates to the technical field of copper plate processing, in particular to a cutting and conveying device for copper plate processing, which comprises a processing base and a laser cutting device, a first conveyor and a second conveyor are mounted on the processing base, a gap is...

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1. Verfasser: CAI GUOPENG
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The utility model relates to the technical field of copper plate processing, in particular to a cutting and conveying device for copper plate processing, which comprises a processing base and a laser cutting device, a first conveyor and a second conveyor are mounted on the processing base, a gap is arranged between the first conveyor and the second conveyor, and the laser cutting device is positioned on the upper side of the gap. A grinding mechanism is arranged at the interval, and the first conveyor and the second conveyor are both connected with a controller. The polishing mechanism comprises a polishing shaft, and the outer side of the polishing shaft is wrapped with abrasive paper. According to the copper plate polishing device, the polishing mechanism is driven by the telescopic mechanism to rotate and inclines towards the upper side or the lower side, the obliquely-arranged polishing mechanism can make contact with the top end and the bottom end of a copper plate and polish the copper plate, the side e