Circuit board with common bonding pad
The utility model relates to a circuit board with a common pad. The circuit board with the common bonding pad comprises a circuit board body and a device mounting part, the device mounting part comprises a first welding part and a second welding part, the first welding part and the second welding pa...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The utility model relates to a circuit board with a common pad. The circuit board with the common bonding pad comprises a circuit board body and a device mounting part, the device mounting part comprises a first welding part and a second welding part, the first welding part and the second welding part are respectively arranged on the circuit board body, and the overlapped part of the first welding part and the second welding part forms a common welding part. According to the scheme provided by the invention, the design cost of the steel mesh can be reduced, and the space of the circuit board can be effectively saved, so that more types of components can be integrated, and the functions of the circuit board are more complete.
本申请涉及一种具有共用焊盘的电路板。该具有共用焊盘的电路板包括:电路板本体和器件安装部,器件安装部包括第一焊接部及第二焊接部,第一焊接部及第二焊接部分别设置于电路板本体上,第一焊接部与第二焊接部重叠的部分形成共用焊接部。本申请提供的方案,能够使得钢网设计成本降低,还能够有效的节省电路板的空间,从而可以集成更多种类的元器件,使得电路板的功能更加齐全。 |
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