Die bonding chip jig

The utility model relates to the technical field of die bond chips, in particular to a die bond chip jig which comprises a fixed base and a processing table and further comprises a dust removal assembly, the dust removal assembly comprises a supporting frame, a sliding seat, a spray head, an air pum...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LI LEYI, KUANG JIALE, HUANG XIANG'EN, TANG FUYU, WEI WENLONG, LIAO YUNFENG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CLEANING CLEANING IN GENERAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS PREVENTION OF FOULING IN GENERAL SEMICONDUCTOR DEVICES TRANSPORTING
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