Die bonding chip jig

The utility model relates to the technical field of die bond chips, in particular to a die bond chip jig which comprises a fixed base and a processing table and further comprises a dust removal assembly, the dust removal assembly comprises a supporting frame, a sliding seat, a spray head, an air pump, a connecting hose and a moving component, the supporting frame is fixedly connected with the fixed base, and the sliding seat is connected with the supporting frame through the moving component. The spray head is fixedly connected with the sliding seat, the air pump is fixedly connected with the fixed base, the connecting hose is connected with the output end of the air pump and communicates with the spray head, the moving component is arranged on the supporting frame and connected with the sliding seat, and impurities and dust on the machining table are cleaned through air sprayed out of a nozzle of the spray head. Therefore, the processing precision of the die bond chip is prevented from being affected by impu