Flexible panel cutting platform

The utility model provides a flexible panel cutting platform, and relates to the field of flexible panel laser cutting devices. Comprising a plurality of single-chip adsorption areas, a plurality of first adsorption holes are formed in the single-chip adsorption areas, and the first adsorption holes...

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Bibliographische Detailangaben
Hauptverfasser:	PAN YONGQIU, LENG ZHIBIN, ZHU PENGCHENG, YUAN PEILONG, LING BUJUN, MENG LI, KIM DEOK-JUN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	The utility model provides a flexible panel cutting platform, and relates to the field of flexible panel laser cutting devices. Comprising a plurality of single-chip adsorption areas, a plurality of first adsorption holes are formed in the single-chip adsorption areas, and the first adsorption holes are communicated with a vacuumizing device; the cutting area is arranged on the periphery of the single chip adsorption area, a first waste chip hole is formed in the cutting groove, and the first waste chip hole is communicated with a vacuumizing device; and the peripheral waste material area is arranged on the edge area of the outer side of the mother board, a plurality of second adsorption holes are formed in the peripheral waste material area, and the second adsorption holes are communicated with a vacuumizing device. The technical problems that due to the fact that an existing cutting platform adopts a vacuum suction cup for adsorption, a flexible panel deforms, the cutting precision is affected, cutting wast