Planar SIC chip structure

The utility model provides a planar SIC chip structure, which belongs to the technical field of SIC chips and comprises an SIC chip body, conductive bumps, a metal radiating fin and a frame body, and the surface of the SIC chip body is provided with a plurality of conductive bumps; the first surface of the metal radiating fin is welded with the back surface of the SIC chip body, and the second surface of the metal radiating fin is welded with the lead frame; the frame body comprises a plurality of supporting parts and a plurality of lead terminals, and the surfaces of the supporting parts and the inner surfaces of the lead terminals are welded to form mounting cavities; the surface of the SIC chip body is inversely mounted in the mounting cavity, and the conductive bumps of the SIC chip body are welded with the inner surfaces of the lead terminals; the gap between the frame body and the SIC chip body is filled with the sealant; and a gap between the supporting parts forms a flow guide channel of the sealant.