Semiconductor wafer cutting equipment

The utility model discloses semiconductor wafer cutting equipment which comprises a top cover, a limiting baffle is installed at the bottom of the top cover, a base is connected to the bottom of the outer surface of the limiting baffle in a sleeved mode, connecting bases are installed on the front face and the back face of the limiting baffle respectively, storage boxes are installed at the front ends and the tail ends of the connecting bases respectively, and control bases are installed in the storage boxes. A material injection opening is formed in the top of the control base, a driving bin is formed in the control base, a pressure pump assembly is installed on the inner bottom wall of the driving bin, a material conveying pipe is installed at the output end of the pressure pump assembly, the tail end of the material conveying pipe is inserted into the control base, and a positioning base is installed on the inner wall of the limiting baffle in an embedded mode. Through induction monitoring of the temperatu