Lifting type semiconductor integrated circuit chip wafer ultrasonic cleaning equipment

The utility model discloses lifting type semiconductor integrated circuit chip wafer ultrasonic cleaning equipment which comprises an ultrasonic cleaning bottom plate, a fixed rear plate is installed on the top of the ultrasonic cleaning bottom plate, a lifting assembly is installed on the front face of the fixed rear plate, and the lifting assembly is used for controlling the wafer to move up and down in the cleaning process. According to the ultrasonic cleaning device, the lifting assembly is installed, the cleaning frame where a semiconductor integrated circuit chip wafer is placed is placed on the top of the L-shaped supporting plate, the bidirectional motor drives the bidirectional ball screw to rotate, the L-shaped supporting plate moves downwards to enable the cleaning frame to enter the ultrasonic cleaning inner groove, and a user is prevented from making contact with ultrasonic cleaning liquid; in the process of ultrasonically cleaning the semiconductor integrated circuit chip wafer, the L-shaped sup