Heat dissipation structure, integrated circuit chip assembly and circuit board

The utility model provides a heat dissipation structure, an integrated circuit chip assembly and a circuit board, the heat dissipation structure comprises a first heat dissipation bonding pad, a heat dissipation through hole and a radiator, the first heat dissipation bonding pad is arranged in a first heat dissipation area on a first surface of a PCB, the first heat dissipation area corresponds to a heat dissipation bonding pad at the bottom of an integrated circuit chip installed on the first surface of the PCB, and the heat dissipation through hole is arranged in the first heat dissipation bonding pad. At least one heat dissipation through hole is arranged and is provided with a plated-through hole wall, the plated-through hole wall is connected with the first heat dissipation bonding pad, and the heat dissipation through hole at least penetrates through the second surface of the PCB in an area corresponding to the first heat dissipation bonding pad; the radiator is installed on the second surface of the PC