SEMICONDUCTOR PACKAGE DEVICE

The utility model provides a semiconductor packaging device which comprises a circuit structure, the circuit structure comprises a differential signal line pad and a non-differential signal line pad, and the size of the differential signal line pad is smaller than that of the non-differential signal line pad. Therefore, by reducing the size of the differential signal line pad, reducing the diameter of the differential signal connecting element and increasing the distance between the differential signal connecting elements, the parasitic capacitance between the pads and the parasitic capacitance between the connecting elements are reduced, so that impedance matching and the differential mode return loss of the whole differential signal line meet preset requirements. 本公开提出了一种半导体封装装置，包括电路结构，所述电路结构包括差分信号线衬垫和非差分信号线衬垫，所述差分信号线衬垫的尺寸小于所述非差分信号线衬垫的尺寸。这样，通过减少差分信号线衬垫的尺寸，减少差分信号连接元件的直径，增加差分信号连接元件之间的间距，以减少衬垫之间的寄生电容以及连接元件之间的寄生电容，使得阻抗匹配，整个差分信号线路的差模回波损耗符合预设需求。