Device for wafer level packaging

The utility model belongs to the technical field of wafer packaging, and particularly relates to a device for wafer-level packaging, which comprises a base, a motor and a press-fit cylinder. A rack is arranged at the bottom of the base, a workbench is arranged at the top of the rack, a machining table is arranged in the middle of the top of the workbench, a carrying plate is arranged on one side of the top of the machining table, and a curved frame is arranged on one side of the top of the workbench. The motor is arranged on one side of the top of the curved frame, the output end of the motor penetrates through the curved frame and is provided with a rotating disc, a glue storage barrel is arranged at the bottom of the rotating disc, hinge frames are arranged at the bottom of the glue storage barrel, a rotating shaft is arranged between the hinge frames, a motor is arranged on one side of each hinge frame, and the output end of the motor is connected with the rotating shaft. An injection pump is arranged on t