Wafer packaging structure

The utility model belongs to the technical field of semiconductor manufacturing, and discloses a wafer packaging structure. The wafer packaging structure comprises a wafer, a connecting layer, a silicon lens and a solder ball, wherein the connecting layer is arranged on the wafer; the silicon lens comprises a bottom layer and spherical protrusions, the bottom layer is in bonding connection with the wafer through the connecting layer, and the spherical protrusions are evenly distributed on the side, away from the connecting layer, of the bottom layer at intervals. The plurality of solder balls are arranged on one side, far away from the connecting layer, of the wafer. According to the wafer packaging structure provided by the utility model, the silicon lens is directly arranged on the connecting layer, the silicon lens plays roles in filtering and converging light rays at the same time, and the silicon lens is low in manufacturing cost and low in power consumption, so that the overall structure is simplified,